NSP1630 series MEMS absolute pressure sensor wafer is mainly designed by using the piezoresistive effect of silicon with independently developed MEMS micromachining process. The sensor wafer manufacturing platform is qualified by IATF16949, and the front/back side of every wafer pass AOI tested which complies with AEC-Q103 standards. This series of MEMS wafers can realize absolute pressure detection, which can be widely used in automotive electronics, medical electronics, white household appliances and industrial control fields.
• Operating temperature range: -40℃~125℃
• Pressure range: 0kPa~200kPa
• The accuracy and stability in the life cycle are less than 1%F.S.
• Automotive-qualified IATF16949-certified process platform
• Comply with RoHS & REACH and halogen-free requirements
• Complies with AEC-Q103 standard
• Single chip size: 1.0mmx1.0mmx0.4mm
• Automotive: motorcycle three-in-one sensor, vehicle TMAP intake pressure detection, BPS battery pack thermal runaway pressure detection, EGR-TMAP exhaust gas recirculation pressure detection, EV/HEV vacuum boosting system sensor, canister desorption pressure detection, VBS vacuum assist sensor, ECU/VCU atmospheric pressure detection, seat air bag pressure detection
• Industrial: pressure transmitter, industrial vacuum degree testing, etc.
